EXPERT 10.6 HXV
MARTIN
5300 W Rework station
Semiautomatic hybrid Rework station for repairing large circuit boards, such as server- or mainboards.
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Top Features
Camera-supported rework
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Flexibility
Various PCB sizes and shapes as well as components available up to 75 x 75 mm2
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Under-heating system
Large PCBs 480 x 480 mm2
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Performance
Uniform heat distribution through convection and hybrid technology
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Multifunctionality
One device for all processes, including desoldering, pad cleaning, automatic positioning and soldering
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Process control
Automatic profiler for under- and top-heating systems
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Software
Simple, intuitive, tablet-compatible
EXPERT 10.6 HXV
Rework Station with 5,300 W hybrid under-heating system. The heating area of 450 x 420 mm2 is adjustable to PCB size. Automated SMD placement process by Auto Vision Placer (AVP) incl. EASYSOLDER 07 software package and DBL 06 control unit with six high resolution sensors inputs for thermocouples (Type K).
This system is particularly suitable for large size PCBs like PCs, Laptops and Server Boards with small up to very big components.
Standard equipment
- Tool set for dispensing, placing, residual solder removal and soldering with magazine
- Set of placement nozzles XL-type (BGA/CSP) 5 mm, 8 mm, 15 mm with O-Ring
- Set of solder nozzles (BGA) 15 mm, 27 mm, 35 mm, 40 mm
- Two camera lenses (BGA und CSP)
- Two thermocouple sensors (type K)
- Six PCB magnet holder 40,5 mm (3x standard, 3x Easy Lock)
- Three PCB clips to install at hand rest
- Foot switch
- Manual
- Intuitive software EASYSOLDER 07 with touch integration
Components
- LED rework
- Daughter boards
- Interposer boards
- Sub assemblies
- RF frames
- RF shields
- Rework on flex
- Small passives down to 0402
- SON
- PGA
- LGA
- QFP
- PoP
- DFN
- QFN
- µBGA/CSP
- BGA up to 75x75mm
- Sockets
- Connectors
- CPU
- Underfiller or coated components
- Film capacitor
Processes
- Dipping
- Paste printing
- Solder removal
- Soldering
- Desoldering
- Reballing
- Dispensing
- Multichip soldering