Top Features

Heating and cooling

• Automated & manual

  Flexibly deployable dispensing heads of various sizes

• Repeatability

  A consistent volume can be dispensed with the volumetric dispensing device, regardless of the viscosity

• Process reliability

  Dispensing pressure, temperature and retract vacuum are configured through the program

• Tempering

  Heating and cooling of media with limited pot life for complicated applications

• Software

  Intuitive software offering use of dispensing recipes and the material library

• Interfaces

  USB, TCP/IP, RS232, Ethernet

CLEVER DISPENSE 06 HC DK

The CLEVER DISPENSE 06 HC embodies a professional dispenser for applications that require highest accuracy and a maximum control of material temperature and viscosity. This dispenser allows heating and cooling (temperature control) of the dispensing nozzle and cartridge. The all-electronic dispensers whose dispensing pressure, temperature and retract vacuum are program-controlled rely on time-pressure-technology. This allows reliable dispensing of very small dots and lines of liquid to pasty material either as 1K-type or 2K-type. You can add your own material to the already existing material library to define essential material parameter and limit values. To ensure a stable process, this device set includes a tempering module for the nozzle — an integrated feature of the dispensing head. Optionally, a cartridge tempering module can be attached to the CLEVER DISPENSE 06 HC which allows the material temperature to be adjusted and controlled. Furthermore, a USB or TCP/ IP interface is available for communication between the dispensing device and the process control computer.

Standard equipment

• Control unit CLEVER DISPENSE 06 HC
• Dispensing head (size of choice) with integrated nozzle tempering
• Connecting cable of dispensing head  (standard 2,6m/ max. 3,0m)
• Pneumatic hose (d=6mm, l=5m)
• Power supply 90-230V AC -> 24V DC
• PC-Software CLEVER DISPENSE Pro
• USB cable
• Short instructio

Materials 

• Alcohol
• Silicone
• Thermal conductive adhesives
• Flux
• Solder paste
• Aqueous
• Oil
• Grease
• Underfill
• Adhesive Conductive Paste

Processes 

• Glob Top
• Line dispensing
• Dot dispensing
• Microdispensing
• Underfill dispensing
• Adhesive bonding
• Coating
• Cooling of the material
• Tempering of the material
• Preheating of the material